Method for manufacturing microelectromechanical system structure having a cavity and through-holes of different widths
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United States of America Patent
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May 19, 2020
Grant Date -
Aug 22, 2019
app pub date -
Apr 29, 2019
filing date -
Sep 27, 2017
priority date (Note) -
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Abstract
Methods for manufacturing MEMS structures are provided. The method for manufacturing a microelectromechanical system (MEMS) structure includes etching a MEMS substrate to form a first trench and a second trench and etching the MEMS substrate through the first trench and the second trench to form a first through hole and an extended second trench. The method for manufacturing a MEMS structure further includes etching the MEMS substrate through the extended second trench to form a second through hole. In addition, a height of the first trench is greater than ¾ of a height of the MEMS substrate, and a height of the second trench is smaller than ⅔ of the height of the MEMS substrate.
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