Stacked printed circuit board packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10631410
SERIAL NO

15710579

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Importance

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Abstract

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The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
APPLE INC1 INFINITE LOOP CUPERTINO CA 95014

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carson, Flynn P Redwood City, US 17 206
Chauhan, Shakti S Cupertino, US 7 107
Crumlin, Alex J San Jose, US 12 230
Jarvis, Daniel W Sunnyvale, US 124 2816
Lee, Meng Chi Los Altos, US 25 214
Pakula, David A San Francisco, US 147 3988
Provencher, Corey S Santa Clara, US 4 17
Pyper, Dennis R San Jose, US 26 483
Salehi, Amir Los Gatos, US 30 290
Spraggs, Ian A San Francisco, US 37 388
Stephens, Gregory N San Jose, US 28 327
Vo, Vu T Salinas, US 3 13
Walters, Derek J San Jose, US 4 142
Yeh, Michael V Cupertino, US 5 49
Zhai, Jun Cupertino, US 143 1553

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