Substrate separation system and method
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United States of America Patent
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Apr 2, 2020
Grant Date -
Apr 2, 2020
app pub date -
Jul 15, 2019
filing date -
Oct 1, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.
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