Substrate processing apparatus and substrate processing method
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United States of America Patent
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Apr 14, 2020
Grant Date -
Jul 27, 2017
app pub date -
Dec 29, 2016
filing date -
Jan 26, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a front surface of a substrate by supplying a liquid refrigerant to a back surface of the substrate at a first position. The second solidifier solidifies the liquid to be solidified by at least one of a first cooling mechanism and a second cooling mechanism. The first cooling mechanism cools the liquid to be solidified by supplying a gas refrigerant toward the substrate at a second position more distant from a center of rotation of the substrate in a radial direction than the first position. The second cooling mechanism cools the liquid to be solidified by bringing a processing surface into contact with the liquid to be solidified at the second position.
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