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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HAKKO CORP	JAPAN OSAKA

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Nemoto, Hisao	Osaka, JP	24	86
Teraoka, Yoshitomo	Osaka, JP	35	258

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Oct 14, 2027
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 14, 2031

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 14, 2020	US,10618127,B2   US10618127B2	GRANTED PATENT AS SECOND PUBLICATION
June 14, 2018	US,20180161903,A1   US20180161903A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 10618127

Vacuum pick-up confirmation system

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