Substrate processing apparatus, substrate processing method, and storage medium

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10606177
APP PUB NO 20190025704A1
SERIAL NO

16029931

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Importance

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Abstract

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There is provided a substrate processing apparatus, including: a mounting table configured to mount a substrate with a pattern mask formed on the substrate inside a process container; a depressurization mechanism configured to perform a pressure-decreasing process of depressurizing an interior of the process container to have a pressure of 1 Pa or lower; a light irradiation mechanism configured to irradiate the substrate with a vacuum ultraviolet light after the interior of the process container is depressurized so that an internal pressure of the process container reaches a pressure of 1 Pa or lower; and a controller configured to output a control signal such that an average depressurization rate inside the process container performed by the depressurization mechanism becomes 250 Pa/sec or lower while the interior of the process container is depressurized from 10,000 Pa to 1 Pa.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO 107-6325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iseki, Tomohiro Kumamoto, JP 31 192
Tanaka, Keiichi Kumamoto, JP 226 4320

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