Die with aligning mechanism, and manufacturing device and method for enameled wire
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Mar 31, 2020
Grant Date -
Dec 6, 2018
app pub date -
Feb 9, 2018
filing date -
Feb 9, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.
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International Classification(s)
- 2018 Application Filing Year
- B05C Class
- 510 Applications Filed
- 367 Patents Issued To-Date
- 71.97 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B05C Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 30, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 30, 2031 |