Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware components
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United States of America
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Mar 24, 2020
Grant Date -
Feb 15, 2018
app pub date -
Aug 11, 2017
filing date -
Aug 11, 2017
priority date (Note) -
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Abstract
Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.
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