Wafer level packaging method
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United States of America
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Mar 3, 2020
Grant Date -
Nov 8, 2018
app pub date -
May 3, 2017
filing date -
May 3, 2017
priority date (Note) -
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Abstract
A wafer level packaging method includes the following steps. A first wafer is bonded over a second wafer. A first grinding process on the first wafer is performed, to remove an upper chamfered edge of the first wafer and reduce a thickness of the first wafer. A trimming process is performed on the first wafer, to remove a lower chamfered edge of the first wafer to form a trimmed first wafer. A second grinding process is performed on the trimmed first wafer, to reduce a thickness of the trimmed first wafer.
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