Integrated circuit (IC) chip arrangement
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United States of America
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Mar 3, 2020
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N/A
app pub date -
Oct 25, 2018
filing date -
Oct 25, 2018
priority date (Note) -
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Abstract
Examples disclosed herein involve integrated circuit chip arrangements. An example integrated circuit (IC) package may include a first semiconductor chip that includes a first metal-oxide-semiconductor field-effect transistor (MOSFET) and a second semiconductor chip mounted within a housing of the IC package. The second semiconductor chip may include a second MOSFET and a control circuit configured with a first driver for the first MOSFET and a second driver for the second MOSFET. The first semiconductor chip may be mounted to the second semiconductor chip opposite a base of the IC package.
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