Semiconductor device resistor including vias and multiple metal layers
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United States of America
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Feb 25, 2020
Grant Date -
Jan 17, 2019
app pub date -
Jul 13, 2017
filing date -
Jul 13, 2017
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Abstract
In one general aspect, an apparatus can include a first terminal, a second terminal, and a resistive element extending between the first terminal and the second terminal. The resistive element can include a first via in contact with a first segment of a first metal layer and a first segment of a second metal layer, and can include a second via in contact with the first segment of the second metal layer and a second segment of the first metal layer. The apparatus can also include a third via in contact with the second segment of the first metal layer and a third segment of the second metal layer.
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