Inductively coupled plasma apparatus
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United States of America
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Feb 25, 2020
Grant Date -
Jul 7, 2016
app pub date -
Mar 15, 2016
filing date -
Mar 15, 2016
priority date (Note) -
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Abstract
Methods and apparatus for plasma processing are provided herein. In some embodiments, a plasma processing apparatus includes a process chamber having an interior processing volume; a first RF coil disposed proximate the process chamber to couple RF energy into the processing volume; and a second RF coil disposed proximate the process chamber to couple RF energy into the processing volume, the second RF coil disposed coaxially with respect to the first RF coil, wherein the first and second RF coils are configured such that RF current flowing through the first RF coil is out of phase with RF current flowing through the RF second coil.
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