Communication node with digital plane interface
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 25, 2020
Grant Date -
Jul 26, 2018
app pub date -
Aug 25, 2016
filing date -
Aug 25, 2016
priority date (Note) -
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Abstract
A solution is provided that can be used in a communication node. A case is provided that supports a first circuit board that is connected to a second circuit board via a connection. The first circuit board supports an integrated circuit module and the second circuit board supports a PHY module. A transformer box is mounted on the first circuit board and supports terminals for engagement with a mating connector. A third circuit board can be provided that is parallel to the second circuit board and is mounted on the transformer box so that termination of signals provided to the terminals can take place on a different circuit board than the second circuit board. The third circuit board can also provide power over Ethernet (POE) circuitry.
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