High entropy alloy having composite microstructure

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United States of America

PATENT NO 10570491
APP PUB NO 20170275745A1
SERIAL NO

15455649

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Abstract

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A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

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Patent Owner(s)

Patent OwnerAddress
THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)99 DAEHAK-RO YUSEONG-GU DAEJEON 34134 34134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Sun Ig Daejeon, KR 6 47
Song, Jae Sook Daejeon, KR 5 47

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