Method for producing multi-level metalization on a ceramic substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10568214
APP PUB NO 20170290169A1
SERIAL NO

15627703

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
CERAMTEC GMBHGERMANY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adler, Sigurd Affalterbach, DE 4 13
Dilsch, Roland Thierstein, DE 5 4
Thimm, Alfred Wunsiedel, DE 21 114

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Aug 18, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 18, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00