Capacitors, integrated assemblies including capacitors, and methods of forming integrated assemblies
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United States of America
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Feb 18, 2020
Grant Date -
Jul 18, 2019
app pub date -
Mar 28, 2019
filing date -
Mar 28, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
Some embodiments include a capacitor. The capacitor has a first electrode with a lower pillar portion, and with an upper container portion over the lower pillar portion. The lower pillar portion has an outer surface. The upper container portion has an inner surface and an outer surface. Dielectric material lines the inner and outer surfaces of the upper container portion, and lines the outer surface of the lower pillar portion. A second electrode extends along the inner and outer surfaces of the upper container portion, and along the outer surface of the lower pillar portion. The second electrode is spaced from the first electrode by the dielectric material. Some embodiments include assemblies (e.g., memory arrays) which have capacitors. Some embodiments include methods of forming capacitors.
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