Low K dielectric compositions for high frequency applications

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10562809
APP PUB NO 20190135683A1
SERIAL NO

16180096

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Abstract

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A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950° C. or below 1100° C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO2, 5-35 mole % or 0.1-35 mole % B2O3, 0.1-10 mole % or 0.1-25 mole % Al2O3, 0.1-10 mole % K2O, 0.1-10 mole % Na2O, 0.1-20 mole % Li2O, 0.1-30 mole % F. The total amount of Li2O+Na2O+K2O is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

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Patent Owner(s)

Patent OwnerAddress
FERRO CORPORATION100 LAKESIDE AVENUE CLEVELAND OHIO 44114

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Orville W Escondido, US 10 53
Coffey, Thomas J Cleveland Heights, US 3 81
Davis, Jackie D Cleveland, US 4 27
Gleason, Cody J Solon, US 3 1
Her, Yie-Shein Canandaiuga, US 18 316
Maloney, John J Solon, US 28 238
Marley, Peter Farmington, US 4 17
Megherhi, Mohammed H Victor, US 6 43
Sakoske, George E Independence, US 71 628
Sridharan, Srinivasan Strongsville, US 135 3479
Tormey, Ellen S Princeton Junction, US 11 96
Wang, Stanley Taipei, TW 35 188
Widlewski, David L Parma Heights, US 2 30

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