Interconnection of conductor to feedthrough

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10561851
APP PUB NO 20170296832A1
SERIAL NO

15638056

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MEDTRONIC INC710 MEDTRONIC PARKWAY N E MINNEAPOLIS MN 55432

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Breyen, Mark Champlin, US 4 78
Miltich, Tom Otsego, US 3 69
Munns, Gordon Stacy, US 14 285

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Aug 18, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 18, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00