Isolation of semiconductor device with buried cavity

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10553675
APP PUB NO 20180108675A1
SERIAL NO

15785627

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Abstract

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In accordance with an embodiment of an integrated circuit, a cavity is buried in a semiconductor body below a first surface of the semiconductor body. An active area portion of the semiconductor body is arranged between the first surface and the cavity. The integrated circuit further includes a trench isolation structure configured to provide a lateral electric isolation of the active area portion.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGNEUBIBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dibra, Donald Munich, DE 12 96
Hellmund, Oliver Neubiberg, DE 25 57
Irsigler, Peter Obernberg/Inn, AT 65 273
Meiser, Andreas Sauerlach, DE 155 859
Schmidt, Sebastian Munich, DE 246 1475
Schulze, Hans-Joachim Taufkirchen, DE 693 4306
Seider-Schmidt, Martina Munich, DE 7 18
Wiesner, Robert Bad Aibling, DE 12 127

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