Internal temperature measuring apparatus and sensor package
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 4, 2020
Grant Date -
Jan 25, 2018
app pub date -
Feb 25, 2016
filing date -
Feb 25, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.
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