Wafer-scale power delivery
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United States of America
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Jan 28, 2020
Grant Date -
Jan 31, 2019
app pub date -
Oct 3, 2018
filing date -
Oct 3, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-silicon vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.
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