Package structure of capacitive coupling isolator
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Jan 21, 2020
Grant Date -
Aug 1, 2019
app pub date -
Oct 19, 2018
filing date -
Oct 19, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2018 Application Filing Year
- H04L Class
- 36042 Applications Filed
- 26734 Patents Issued To-Date
- 74.18 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H04L Class
- 36.26 % this patent is cited more than
- 5 Age
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