Etching solution composition for tungsten layer, method for preparing electronic device using the same and electronic device

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United States of America

PATENT NO 10538846
APP PUB NO 20170167032A1
SERIAL NO

15259669

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Abstract

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The present disclosure relates to an etching solution composition for a tungsten layer including N-methylmorpholine N-oxide and water, which is effective in selectively etching only a tungsten-based metal without etching a titanium nitride-based metal or a titanium aluminum carbide layer.

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Patent Owner(s)

Patent OwnerAddress
DONGWOO FINE-CHEM CO LTD(SINHEUNG-DONG) 132 YAKCHON-RO IKSAN-SI JEOLLABUK-DO 54631 54631

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Yong-Jun Daejeon, KR 12 44
Kim, Seong-Min Iksan-si, KR 155 2396
Lee, Kyong-Ho Osan-si, KR 8 34

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