Piezoelectric film and process for producing same
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United States of America
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Jan 14, 2020
Grant Date -
Apr 5, 2018
app pub date -
Apr 1, 2016
filing date -
Apr 1, 2016
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Abstract
A piezoelectric film which is better in heat and deformation resistant properties than those in the prior art is provided along with a method of manufacture. The film is a piezoelectric film that is composed of a copolymer of vinylidene fluoride and trifluoroethylene, the copolymer having a content of vinylidene fluoride in a range of not less than 82 mol % and not more than 86 mol % and having a molecular weight not less than 600,000. The piezoelectric film is subjected to a heat treatment for crystallization of the copolymer at a temperature ranging from not less than 140° C. to not more than 150° C., and is thereby caused to develop piezoelectric property. The piezoelectric film further has a heat resistance of not less than 140° C. and a breaking distortion of not less than 8% and not more than 55%, and an excellent deformation resistant property.
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