Semiconductor device packages and stacked package assemblies including high density interconnections

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10535521
APP PUB NO 20190206684A1
SERIAL NO

16297480

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Abstract

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A method of forming a semiconductor device package includes: (1) providing an electronic device including an active surface and a contact pad adjacent to the active surface; (2) forming a package body encapsulating portions of the electronic device; and (3) forming a redistribution stack, including: forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace, wherein the second portion of the first trace is disposed between and spaced from opposing sidewalls of the dielectric layer defining the first opening.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INC26 CHIN 3RD ROAD NANZIH DIST KAOHSIUNG 811

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, William T Kaohsiung, TW 25 548
Hung, Chih-Pin Kaohsiung, TW 71 813
Hunt, John Richard Kaohsiung, TW 9 225
Wang, Chen-Chao Kaohsiung, TW 41 351

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