Stress reduction dimples for circular holes
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United States of America
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Jan 14, 2020
Grant Date -
May 17, 2018
app pub date -
Nov 15, 2016
filing date -
Nov 15, 2016
priority date (Note) -
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Abstract
A method of reducing stress concentration in a material subjected to a predominant stress in a direction parallel to an axial plane defined through an axis of a circular cylindrical hole in the material between a first material surface and a second material surface, the material having a material thickness defined between the first material surface and the second material surface, the method comprising: forming a first proximal recess in the first material surface on the axial plane having a depth less than the material thickness, the first proximal recess having an outer edge spaced a first proximal dimension in the axial plane from a first rim of the hole; and forming a second proximal recess in the second material surface on the axial plane having a depth less than the material thickness, the second proximal recess having an outer edge spaced a second proximal dimension in the axial plane from a second rim of the hole, wherein the first proximal dimension on the first material surface is diametrically opposite, relative to the hole, to the second proximal dimension on the second material surface.
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