Method for bonding using adhesive layers with the aid of a laser

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10533077
APP PUB NO 20160333154A1
SERIAL NO

15223793

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state by heating before being bonded to the first substrate.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TRUMPF LASER- UND SYSTEMTECHNIK GMBHJOHANN-MAUS-STR 2 DITZINGEN 71254

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berger, Michael Ditzingen-Hirschlanden, DE 128 1266
Blodau, Marcel Krefeld, DE 9 10
Kinzelmann, Hans-Georg Pulheim, DE 41 130
Sauter, Martin Korntal-Muenchingen, DE 16 321

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 14, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 14, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00