Annealing method for improving bonding strength

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United States of America

PATENT NO 10529590
APP PUB NO 20180330964A1
SERIAL NO

15906074

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Abstract

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The present disclosure provides an annealing method for improving interface bonding strength of a wafer. The method includes: providing a substrate, the substrate having a bonding interface; performing a first annealing step, wherein the first annealing step is practiced in an oxygen-containing atmosphere, and an oxidation protection layer is formed on a surface of the substrate through the annealing step; and performing a second annealing step upon the first annealing step, wherein a temperature of the second annealing step is higher than that of the first annealing step, and the second annealing step is practiced in a nitrogen-free environment.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI SIMGUI TECHNOLOGY CO LTD201821 200 PRATT & WHITNEY ROAD SHANGHAI JIADING DISTRICT MUNICIPAL DISTRICT SHANGHAI CITY 201821

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yongwei Shanghai, CN 4 4
Chen, Guoxing Shanghai, CN 17 7
Chen, Meng Shanghai, CN 147 588
Fei, Lu Shanghai, CN 25 412
Wang, Xi Shanghai, CN 356 3114
Wei, Xing Shanghai, CN 112 674

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