High dielectric breakdown strength resins

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10526439
APP PUB NO 20180291138A1
SERIAL NO

15483834

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Abstract

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A resin formulation that can be cured thermally or by light, where the cured resin is an amorphous, thermoset polymer.

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Patent Owner(s)

Patent OwnerAddress
LOMBARDI JOHN LTUCSON AZ

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lombardi, John L Tuscon, US 40 446

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