Chemical-mechanical polishing abrasive pad conditioner and method for manufacturing same
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United States of America
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Jan 7, 2020
Grant Date -
Nov 15, 2018
app pub date -
Jan 30, 2018
filing date -
Jan 30, 2018
priority date (Note) -
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Abstract
The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.
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