Method for fabricating flexible substrate

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United States of America

PATENT NO 10517171
SERIAL NO

15527261

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Abstract

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The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDSEOUL SOUTH KEREAN SEOUL

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Hye Won Daejeon, KR 31 199
Kim, Kyungjun Daejeon, KR 36 233
Lim, Chang Yoon Daejeon, KR 13 19
Shin, Bo Ra Daejeon, KR 9 23
Son, Yong Goo Daejeon, KR 49 134

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