Hot melt adhesive

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10513639
SERIAL NO

15384457

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Abstract

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The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing, and has excellent thermal stability and adhesion, in particular adhesion to a paper material. The present invention relates to a hot melt adhesive comprising: (A) an olefin-based polymer, (B) a butyral resin, (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, and (D) a tackifier resin.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAAHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takamori, Ai Osaka, JP 23 33

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