Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

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United States of America

PATENT NO 10513605
SERIAL NO

15316880

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Abstract

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The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

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Patent Owner(s)

Patent OwnerAddress
SHENGYI TECHNOLOGY CO LTDNO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fang, Kehong Guangdong, CN 13 17
Li, Hui Guangdong, CN 1361 15841
Xu, Yongjing Guangdong, CN 25 33

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