Metallic copper dispersion, method for manufacturing same, and usage for same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10507524
SERIAL NO

14907010

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Abstract

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The purpose of the present invention is to provide a metallic copper dispersion: capable of maintaining dispersion stability of metallic copper particles for a long period of time; suitable for inkjet printing, spray coating, or the like; and capable of allowing a metallic copper-containing film having an excellent electrical conductivity and metallic color tone to be manufactured in a simple manner by performing low-temperature heating or plasma irradiation after application. The metallic copper dispersion is a dispersion containing at least an organic solvent, a polymer dispersant, and metallic copper particles having gelatin on the particle surface, wherein the metallic copper particles in the dispersion have a cumulative 50% particle size (D50) of 1-130 nm and a cumulative 90% particle size (D90) of 10-300 nm, and the polymer dispersant has an amine number of 10-150 mgKOH/g. The metallic copper dispersion is manufactured by reducing copper oxide in an aqueous solvent in the presence of gelatin, then performing solid-liquid separation, and then mixing the obtained metallic copper particles having gelatin on the particle surface and the polymer dispersant into the organic solvent.

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Patent Owner(s)

Patent OwnerAddress
ISHIHARA SANGYO KAISHA LTDNISHI-KU OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ida, Kiyonobu Yokkaichi, JP 4 36
Watanabe, Mitsuru Yokkaichi, JP 92 1094

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