Component bonding device
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United States of America Patent
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Nov 19, 2019
Grant Date -
Dec 24, 2015
app pub date -
Jun 18, 2015
filing date -
Jun 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.
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