Bonding arrangement and production method
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United States of America Patent
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Nov 19, 2019
Grant Date -
Mar 22, 2018
app pub date -
Sep 18, 2017
filing date -
Sep 21, 2016
priority date (Note) -
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Abstract
In order to provide a new and improved bonding arrangement, especially for use in an aircraft or spacecraft, which is designed to overcome problems of bonding arrangements under Mode I loading stress and which is designed or configured particularly to create a bond design which is incapable of locally loading the adhesive bond above the peel strength, a bonding arrangement is disclosed with a coating structure, which is split into a plurality of neighboring structural elements spatially separated from each other, and at least one supporting member is provided, which comprises a plurality of recesses receiving the structural elements in operating position.
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