Method of calibrating a nanometrology instrument
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United States of America Patent
Stats
-
Nov 12, 2019
Grant Date -
Mar 31, 2016
app pub date -
Sep 22, 2015
filing date -
Sep 30, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of calibrating a topography metrology instrument using a calibration reference, which includes a substrate and a plurality of bi-layer stacks. Each bi-layer stack includes a plurality of bi-layer steps. At least one bi-layer step of the plurality of bi-layer steps includes two materials. The at least one bi-layer step of the plurality of bi-layer steps includes an etch stop layer and a bulk layer. The calibration reference includes a calibration reference step profile includes a plurality of predetermined bi-layer stack heights. The calibration reference step profile and the predetermined bi-layer stack heights are measured using a topography metrology instrument. The topography metrology instrument is calibrated based on the measured calibration reference step profile and the measured bi-layer stack heights.
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International Classification(s)
- 2015 Application Filing Year
- G01Q Class
- 101 Applications Filed
- 89 Patents Issued To-Date
- 88.12 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- G01Q Class
- 0 % this patent is cited more than
- 6 Age
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