Diene/dienophile couples and thermosetting resin compositions having reworkability
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United States of America Patent
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Nov 12, 2019
Grant Date -
Jun 7, 2018
app pub date -
Oct 27, 2017
filing date -
Mar 22, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
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International Classification(s)
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- C07D:HETEROCYCLIC COMPOUNDS
- C07C:ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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