Hermetic feedthrough for an implantable medical device
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United States of America Patent
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Nov 12, 2019
Grant Date -
Nov 3, 2016
app pub date -
Jul 12, 2016
filing date -
Aug 2, 2011
priority date (Note) -
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Abstract
A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO2, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.
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