Method for manufacturing circuit board

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United States of America Patent

PATENT NO 10470317
APP PUB NO 20190141842A1
SERIAL NO

15853990

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Abstract

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A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

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Patent Owner(s)

Patent OwnerAddress
UNIMICRON TECHNOLOGY CORPNO 179 SHANYING RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chi-Min Taoyuan, TW 19 25
Huang, Hsiang-Hung New Taipei, TW 5 3

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