Circuit substrate with embedded heat sink
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United States of America Patent
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Nov 5, 2019
Grant Date -
Oct 25, 2018
app pub date -
Jun 24, 2018
filing date -
May 21, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.
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