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United States of America Patent

PATENT NO 10468319
APP PUB NO 20180150673A1
SERIAL NO

15492232

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic package is formed by placing a semiconductor die within an opening in a leadframe and performing a first molding operation. The die is wirebonded to the leadframe and a final encapsulation is performed with a second molding operation.

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Patent Owner(s)

Patent OwnerAddress
CARSEM (M) SDN BHDKUALA LUMPUR

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Khor, Lily Ipoh, MY 11 521
Ng, Yan Shan Ipoh, MY 1 1

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