Wedge bonding tools, wedge bonding systems, and related methods

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10449627
APP PUB NO 20180200828A1
SERIAL NO

15924056

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ORTHODYNE ELECTRONICS CORPORATION2300 MAIN STREET SECTION B IRVINE CA 92714

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeAngelis, Dominick A Villanova, US 19 162

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 22, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 22, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00