Latent heat transfer material micro-encapsulated in hard shell, and production method for same
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United States of America Patent
Stats
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Oct 15, 2019
Grant Date -
Sep 1, 2016
app pub date -
Aug 25, 2014
filing date -
Aug 23, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided is a latent heat transfer material that is micro-encapsulated, said material exhibiting superior mechanical strength and heat resistance. A production method for the latent heat transfer material that is micro-encapsulated in a hard shell comprises: 1) a step in which a perforate hollow silica particle is manufactured; 2) a step in which the phase change material is sealed inside the perforate hollow silica particle by inserting the perforate hollow silica particle in a molten solution of the phase change material and repeatedly subjecting the same to vibrations such as ultrasound oscillations; 3) a step in which the perforate hollow silica particle having the phase change material sealed within is washed in a saturated aqueous solution of the phase change material; and 4) a step in which perhydropolysilazane is used to coat the outer shell of the perforate hollow silica particle with silica.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY | 1-1 ROKKODAI-CHO NADA-KU KOBE-SHI HYOGO 6578501 ?6578501 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hidema, Ruri | Hyogo, JP | 1 | 2 |
Komoda, Yoshiyuki | Hyogo, JP | 10 | 806 |
Suzuki, Hiroshi | Hyogo, JP | 997 | 14336 |
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