Passive hydraulic load leveler for thermal compression bonding
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United States of America
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Oct 8, 2019
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N/A
app pub date -
Jun 28, 2016
filing date -
Jun 28, 2016
priority date (Note) -
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Abstract
A press including a passive load leveler for bonding integrated circuit wafers, chips or substrates. The press includes a press frame, a press ram moveable relative to the frame, a first platen coupled to the press ram, and a second platen coupled to the press frame. The load leveler is coupled between the press frame and the second platen, and includes a main body having a first surface coupled to the press frame a plurality of pistons extending from the main body through a second surface and being in contact with the second platen. Each of the pistons is positioned within a piston chamber that is in fluid communication with a network of channels within the main body, where the pistons move relative to each other through a working fluid within the channels so as to maintain the first and second platens parallel to each other under the ram pressure.
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