Thermoforming method and thermoforming apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10434700
APP PUB NO 20170100875A1
SERIAL NO

15221546

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Abstract

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Provided is a method of thermoforming a molding material to have a bent portion and a flat portion extending from the bent portion. The method includes: placing the molding material on a bending mold, the bending mold having a curved surface; and forming the bent portion of the molding material by heating a portion of the molding material at least to a fluidization temperature such that the portion of the molding material bends due to the weight of the flat portion of the molding material to form the bent portion according to a shape of the bending mold.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG DISPLAY CO LTDSOUTH KOREA GYEONGGI DO YONGIN YONGIN GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eo, Sungwoo Suwon-si, KR 11 8
Kim, Hunkyo Cheonan-Si, KR 3 6
Oh, Jusuk Cheonan-si, KR 5 3
Shim, Byoungyul Asan-si, KR 6 7

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