MEMS transducer package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 3, 2019
Grant Date -
Dec 28, 2017
app pub date -
Dec 4, 2015
filing date -
Dec 23, 2014
priority date (Note) -
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Abstract
A MEMS transducer package is provided having a semiconductor die portion with a thickness bounded by a first surface and an opposite second surface. The package further has a transducer element incorporated in the second surface and a die back volume that extends through the thickness of the semiconductor die portion between the first surface and the transducer element. The package is completed by a cap portion that abuts the semiconductor die portion at the first surface.
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