X-ray stress analysis apparatus, method, and program
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United States of America Patent
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Sep 3, 2019
Grant Date -
Mar 23, 2017
app pub date -
Aug 10, 2016
filing date -
Sep 18, 2015
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Abstract
A stress analysis apparatus capable of improving the accuracy of a stress value, a method, and a program are provided. A stress analysis apparatus 100 that calculates a residual stress of a sample S includes an analysis unit configured to calculate an error as one of solutions by using an equation including an error term and prescribing a relationship between stress and strain with using measured values of diffracted X-rays with respect to a plurality of scattering vectors and a provisional value when the stress in a direction perpendicular to the surface of the sample S is constant, and a provisional value correction unit configured to correct the provisional value using the calculated error, and the analysis unit and the provisional value correction unit repeat the calculation of the error and the correction of the provisional value.
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