Methods of forming holes in a workpiece and associated systems
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United States of America Patent
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Sep 3, 2019
Grant Date -
Aug 17, 2017
app pub date -
Feb 17, 2016
filing date -
Feb 17, 2016
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Abstract
Described herein is a first method of forming a hole in a workpiece, having a first surface and a second surface opposite the first surface. The method includes forming a first hole, having a first diameter, in the workpiece by passing a first cutter through the workpiece from the first surface to the second surface. Additionally, the method includes forming a chamfer in the second surface of the workpiece concentric with the first hole using a second cutter. The chamfer has a second diameter larger than the first diameter. The method further includes forming a second hole, having a third diameter larger than the first diameter, in the workpiece concentric with the first hole by passing a third cutter through the workpiece from the first surface to the second surface.
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