Process of manufacturing droplet jetting devices
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United States of America Patent
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Aug 27, 2019
Grant Date -
Oct 11, 2018
app pub date -
Oct 7, 2016
filing date -
Oct 13, 2015
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Abstract
A process of manufacturing droplet jetting devices includes bonding together a nozzle wafer defining nozzles of the jetting devices, a membrane wafer carrying, on a membrane, actuators for generating pressure waves in a liquid in pressure chambers that are connected to the nozzles, and a distribution wafer forming a distribution layer that defines supply lines for supplying the liquid to the pressure chambers from a liquid reservoir formed on a side of the distribution layer opposite to the membrane wafer; and dicing the bonded wafers. The distribution layer has a thickness larger than the thickness of each of the other two wafers. A restrictor for controlling the inertance of the liquid supply line is formed through the distribution layer in a direction normal to the plane of that layer.
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